Micron Unveils Roadmap to 2030: Vertical HBM and AI-Driven Chip Design

1 reports archived0 independent sourcesupdated 10/24/2026, 18:14:50

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Micron detailed its storage roadmap through 2030, highlighting 'vertical HBM' by 2028 to shorten data paths and improve energy efficiency. The company also leveraged AI agents for chip logic and firmware, cutting SSD controller design time by 50% and accelerating customer readiness.

LATEST/Micron detailed its storage roadmap through 2030, highlighting 'vertical HBM' by 2028 to shorten data paths and improve energy efficiency. The company also leveraged AI agents for chip logic and firmware, cutting SSD controller design time by 50% and accelerating customer readiness.

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Rohan Paul (@rohanpaul_ai)T2Oct 24, 18:14·78 pts
Micron Unveils Roadmap to 2030: Vertical HBM and AI-Driven Chip Design
- Micron plans to introduce 'vertical HBM' by 2028, stacking memory directly on GPUs to boost AI output per watt.
- AI agents writing chip logic and firmware reduced SSD controller design time by 50% and customer readiness by 60%.
- Data reveals a single HBM4 stack moves 2.8 TB/s, while AI context length is growing at 30x per year.
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