英飞凌
German semiconductor maker specializing in power devices, automotive electronics and microcontrollers, a leader in SiC power sem
Infineon closed fiscal 2026 with revenue of EUR 16.35 billion, up 12% year over year, and operating profit up 46%, with the fourth quarter setting multiple records. Management flagged data-center power, energy infrastructure, electric mobility and software-defined vehicles as core growth drivers, alongside robotics and edge AI as emerging markets.
The CEOs of Infineon, STMicroelectronics and NXP argued at a Munich industry conference that Europe's automotive and industrial expertise gives it a credible shot at competing with the US and Asia in robotics and physical AI. Infineon's chief called physical AI a field Europe must win, while STMicroelectronics has signed a factory humanoid robot deployment deal with Oversonic, though such projects remain at pilot stage.
Infineon has become the first to process 300mm silicon carbide wafers into power semiconductor devices at full-scale production, using existing silicon equipment at its Villach fab in Austria. The company is advancing its 200mm SiC roadmap and has validated cold-split technology on 12-inch SiC at its Dresden site to cut ingot-to-wafer losses.
Infineon has processed 300mm silicon carbide wafers into functional power devices at its Villach fab, becoming the first company to achieve this in a full-scale semiconductor production environment using existing silicon equipment. The milestone lays the process foundation for scalable, secure SiC supply across automotive, renewable energy, industrial and AI data center applications, with the first processed wafer to be shown at electronica in Munich from 10 November.